Other grades of this product :
| 11-Hydroxyundecylphosphonic acid, 95% Basic information |
| 11-Hydroxyundecylphosphonic acid, 95% Chemical Properties |
| Melting point | 107-111 °C | | form | powder |
| Hazard Codes | Xi | | Risk Statements | 36/37/38 | | Safety Statements | 26 | | WGK Germany | 3 |
| 11-Hydroxyundecylphosphonic acid, 95% Usage And Synthesis |
| Uses | HUPA is mainly used as a spacer/linker that forms a SAM on titanium oxide (TiO2) surfaces to immobilize the surface atoms for the formation of biocompatible materials for biomedical applications. It can also be used to functionalize the silicon-photonic resonators for biosensing applications. | | General Description | 11-Hydroxyundecylphosphonic acid (HUPA) is an alkyl phosphonic acid that forms a self-assembled monolayer (SAM) on a variety of metal oxides and metal surfaces. It forms a hydroxyl terminated SAM that provides a physiological stability and controls the surface density of the coating. |
| 11-Hydroxyundecylphosphonic acid, 95% Preparation Products And Raw materials |
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