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| Parylene F Dimer Basic information |
| Product Name: | Parylene F Dimer | | Synonyms: | Dimer,Parylene F;5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene;Parylene F Dimer;Parylene F;4,5,7,8,12,13,15,16-Octafluoro[2.2]paracyclophane;4,5,7,8,12,13,15,16-Octafluoro[2.2]paracyclophane>Tricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene, 5,6,11,12,13,14,15,16-octafluoro-;Parylene VT-4 | | CAS: | 1785-64-4 | | MF: | C16H8F8 | | MW: | 352.22 | | EINECS: | | Product Categories: | | Mol File: | 1785-64-4.mol |
| Parylene F Dimer Chemical Properties |
| Melting point | >205 °C (sublm) | | Boiling point | 321 ºC | | density | 1.497 | | Fp | 117 ºC | | storage temp. | 2-8°C | | solubility | soluble in Toluene | | form | powder to crystal | | color | White to Almost white |
| Parylene F Dimer Usage And Synthesis |
| Description | Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types. | | Physical properties | TYPICAL PROPERTIES OF DEPOSITED PARYLENE F FILMGas Permeability, O2: 16.7 (cc*mm)/(m2*day*atm)Short Term Service Temperature: 250℃Continuous Service Temperature: 200℃Coefficient of Friction (Static and Dynamic): 0.35Rockwell Hardness: R80Tensile Strength: 7,800 psiPenetration Power: 30 XDielectric Strength @ 1 mil: 7.0 KVUSP Class VI Polymer: Yes | | Uses | Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation | | benefits | Parylene F film meets all requirements of MIL-I-46058C, IPC-CC-830B and NASA-STD-8739.1 as type XYUSP Class VI biocompatibilityUL-94 V-0 flammability ratingNo VOC's or solvents used in deposition processRoHS and REACH compliantVapor deposition has a high penetration power and is extremely conformalDeposition occurs in a vacuum chamber occurs at room temperature and does not exert any force during depositionNo curing cycleExcellent barrier and dielectric propertiesChemically and biologically inertExtremely thin and lightweight coatingNo outgassing, approved by NASA HydrophobicAble to sterilize with all common sterilization methods | | storage | Store in a cool, dark place in the original unopened container when not in use. Do not place in view of UV light source including sunlight. Dimer is not known to degrade when stored out of direct sunlight and below 30°C. Recommend retesting after five years from manufacturer date. |
| Parylene F Dimer Preparation Products And Raw materials |
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